Email: lyang@cyf-ic.com
PCB specification
· Layer: 1 to 12 layers
· Material: FR-4, CEM-1, CEM-3, Height TG, FR4 halogen free, FR-1, FR-2,Aluminum etc.
· Max. finished thickness: 0.2 to 4.0mm (0.02 ~ 0.25″)
· Max. finished board side: 500 x 500mm (20 x 20”)
· Min. drilled hole size: 0.25mm (10mil)
· Min. line width: 0.10mm (4mil)
· Min. line spacing: 0.10mm (4mil)
· Surface finish/treatment: HALS/HALS lead free, chemical tin, chemical gold, immersion gold, plating gold
· Copper thickness: 0.5 to 3.0 oz
· Solder mask color: green/black/white/red/blue
· Inner packing: plastic bag
· Outer packing: standard carton packing
· Hole tolerance: PTH: ±0.076, NTPH: ±0.05
· Profiling punching: routing, V-cut, beveling
· Providing OEM service to all sorts of printed circuit board assembly